We will proudly participate as a Sponsor in the 38th International CAE Conference. The event will be divided into two separate and complementary initiatives: 16-17 November will be dedicated to software technology producers, each of whom will have a channel … Read More
Monthly Archives: November 2022
An RBF Meshless Approach to Evaluate Strain Due to Large Displacements in Flexible Printed Circuit Boards
We are pleased to announce that our paper entitled RBF Meshless Approach to Evaluate Strain Due to Large Displacements in Flexible Printed Circuit Boards has been published on Micromachines 2022. The paper can be downloaded at the following link: https://doi.org/10.3390/mi13081163 Abstract Thin … Read More