RBF Morph will participate to ANSYS Convergence 2015 Regional Conference that will take place on April 21, 2015 at Hyatt Regency Santa Clara. The presentations will cover a variety of industries and will be done by ANSYS and industry-leading experts.
RBF Morph will present with Ozen Engineering Inc. how engineers can use a fast morphing method to do shape sensitivity simulation for BGA solder joint reliability assessment.
The presentation will held in the Structural Mechanics session and include a case study highlighting the use of ANSYS Mechanical and ANSYS ACT Extension RBF Morph for this application.
Topic: BGA/Solder Joint Reliability Sensitivity Simulations using ANSYS
Authors: Prof. Marco Evangelos Biancolini, Dr. Corrado Groth and Metin Ozen, Ph.D.
Abstract: In the electronics industry, a typical package has many dimensional variations due to manufacturer’s process variations.
These variations may include changes in ball/solder joint dimensions, height, pitch, SMD/NSMD pad dimensions, and even boundary condition locations during tests.
These variations can be easily addressed using the new functionality in Ansys called “RBF Morph ACT Extension” which can be applied to any geometry and/or any physics where geometric variations are of concern. In this paper, we will present electronics package variations as an example to demonstrate how RBF Morph can be employed to address variational concerns
